Academic Staff

Several research assistant positions (master degree), postdoc positions (Ph.D degree) and summer internship positions are immediately available at the department of electrical and electronic engineering, the University of Hong Kong. Experiences on computational electromagnetics, antennas, EMC/EMI, or numerical methods are preferred. Students and graduates with EE, Physics and computational physics backgrounds are welcome to apply. Competitive payment based on background and policies will be provided.

Electromagnetics, IC Signal and Power Integrity, Antennas, EMC/EMI, Multidisciplinary EDA Solutions, RF and Microwave Technologies.
 
Lijun Jiang received the Bachelor Degree in electrical engineering from the Beijing University of Aeronautics and Astronautics in 1993, the Master Degree from the Tsinghua University in 1996, and the Ph.D from the University of Illinois at Urbana-Champaign (UIUC) in 2004.  From 1996 to 1999, he was an Application Engineer with the Hewlett-Packard Company (HP).  From 2004 to 2009, he has been the Postdoc, the Research Staff Member, and the Senior Engineer at IBM T.J. Watson Research Center.  Since Dec. 2009, he has been the associate professor at the Department of Electrical and Electronic Engineering, the University of Hong Kong.

At Tsinghua University, he worked on broadband slot-coupled patch antenna analysis and design.  One of his works for GPS systems has received the best paper award from the 1st Chinese GPS Technology Symposium.  At HP, he provided technical support on RF and microwave measurement technologies, delivered HP EEsof EDA solutions, and worked on customized system integrations.  In 1998 he received the HP STAR Award.  At UIUC he conducted extensive theoretical researches on fast multipole algorithms (FMA), broadband integral equations, and parasitic parameter extraction methodologies.  In 2003 he received the IEEE MTT Graduate Fellowship Award.  In 2004 he received the UIUC Y.T. Lo Outstanding Research Award.  At IBM he worked on computational electromagnetics methodologies for parasitic parameter extraction, on-chip back-end-of-the-line (BEOL) modeling, and multiphysics (thermal-electrical coupling) EDA solutions for IC interconnects, packaging, and 3D integration (3DI).  He received the IBM First Patent Application Invention Achievement Award in 2007 and the IBM Research Accomplishment Award in 2008. 

As to teaching, he has mentored or co-mentored 5 summer intern graduate students from several US universities over three research initiatives at IBM Research.  Two US patents and one IBM Research achievement award have been generated directly from these supervision activities.  At HP he acted as a professional teacher.  He tailored a wide range of engineering courses for RF/microwave measurements and EDA technologies.  The longest course he taught lasted 5 full days in a row.  Hundreds of industrial engineers and academic students have listened his course lectures, open seminars, and special topic trainings.  He also advised invited professors to give better lectures for HP.

He is an IEEE Member, an IEEE Antennas and Propagation Society (AP-S) Member, a Sigma Xi Member.  He was the Semiconductor Research Cooperation (SRC) Industrial Liaison for several academic projects. In 2009, he was the SRC Packaging TT Chair.  He has been the special issue associate guest editor of IEEE Transactions on Antennas and Propagations since 2011, the technical committee panel member of IEEE EDAPS since 2010, the scientific committee member of 2010 IEEE SMEE, the special session organizers of IEEE EDAPS and ACES, co-organizer of HKU Computational Science and Engineering Workshops in 2010 and 2011, TC-9 and TC-10 member of IEEE EMC-S since 2011, and session chairs of many IEEE international conferences in his field. He also serves as the reviewer of IEEE Transactions on several topics, and other primary electromagnetics and microwave related journals.  His research interests focus on electromagnetics, IC signal/power integrity, antennas, multidisciplinary EDA solutions, RF and microwave technologies, and high performance computing (HPC), etc.

• J. Liu and L.J. Jiang, “Alternative AEFIE-EFIE method for wide frequency range analysis,” accepted to Microwave and Optics Technology Letters.
• P. Li and L.J. Jiang, “The Far Field Transformation for The Antenna Modeling Based on Spherical Electric Field Measurements,” Progress in Electromagnetics Researches (PIER), vol. 123, pp243-261, 2012.
• P. Yang, S.Q. He, Yan Li, and L.J. Jiang, “Low-Profile Micropstrip Antenna with Bandwidth Enhancement for RFID Applications,” Electromagnetics, vol. 32, no. 4, 2012.
• J. Huang, W.C. Chew, M. Tang, and L.J. Jiang, “Efficient Simulation and Analysis of Quantum Ballistic Transport in Nanodevices with Asymptotic Waveform Evaluation (AWE),” IEEE Trans. on Electron Devices, vol. 59, issue. 2, pp 468-476, Feb. 2012.
• S.Q. He, W.E.I. Sha, L.J. Jiang, W.C. Chew, W. Choy, and N.J. Ping, “Finite Element Based Generalized Impedance Boundary Condition for Modeling Plasmonic Nanostructures,” IEEE Trans. On Nanotechnology, vol. PP, issue. 99, Nov. 2011.
• P.H. Yang, Y. Li, L.J. Jiang, and W.C. Chew, “Compact Metallic RFID Tag Antennas with A Loop-Fed Method,” IEEE Trans. on Antennas and Propagations, issue 99, Aug. 2011.
• Y. Li, S. SUN, F. Yang, and L.J. Jiang, “Design of Dual-band Slotted Patch Hybrid Couplers Based on PSO Algorithm,” JEMWA, vol. 25, no. 17/18, pp 2409-2419, 2011.
• Y. P. Chen, W. C. Chew, and L.J. Jiang, "A novel implementation of discrete complex image method for layered medium Green’s function", IEEE Trans. On Antennas and Wireless Propagation Letters, vol. 10, pp 1536-1225, May 2011.
• Y.P. Chen, L.J. Lijun, Z.G. Qian, W.C. Chew, “An Augmented Electric Field Integral Equation for Layered Medium Green's Function,” IEEE Trans. On Antennas and Propagations, vol. 59, issue. 3, pp 960 ~ 968, Mar. 2011.
• L.J. Jiang, X. Chuan, B.J. Rubin, A.J. Weger, A. Deutsch, H. Smith, A. Caron, and K. Banerjee, “A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures,” IEEE Trans. On Adv. Packaging, Vol. 33, Issue 4, pp 777 ~ 786, Nov. 2010.
• Y.G. Liu, W.C. Chew, L.J. Jiang and Z.G. Qian, “A Memory Saving Fast A-EFIE Solver for Modeling Low-Frequency Large Scale Problems”, Applied Numerical Mathematics, Doi:   10.1016/j.apnum.2010.11.012, Nov. 2010.
• A.T. deHoop and L.J. Jiang, “Pulsed EM Field Response of a Thin, High-contrast, Finely Layered Structure with Dielectric and Conductive Properties,” IEEE Trans. on Antennas and Propagations, vol 57, no. 8, pp 2260-2269, Aug. 2009.
• M.S. Tong, W.C. Chew, A. Deutsch, B. Rubin, J. Morsey, L.J. Jiang, “Dual Basis for Solving Electromagnetic Surface Integral Equations”, IEEE Trans. On Antennas and Propagations, vol. 57, issue 10, pp 3136 ~ 3146, 2009.
• J. Morsey, A. Deutsch, J.P. Libous, C. Surovic, B. J. Rubin, L.J. Jiang, and L. Eisenberg, “The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM,” IEEE Trans. on Advanced Packaging, vol. 30, num. 2, pp288-294, 2007.
• L.J. Jiang and W.C. Chew, “A Complete Variational Method for Capacitance Extractions”, Progress in Electromagnetics Research, PIERS 56, pp 19-32, 2006.
• M.K. Li, W.C. Chew, and L.J. Jiang, “A Domain Decomposition Scheme Based on Equivalence Theorem,” Microwave and Optical Technology Letter, vol. 48, issue 9, pp 1863-1857, Sept. 2006.
• L.J. Jiang and W.C. Chew, “A Mixed-Form Fast Multipole Algorithm,” IEEE Transaction on Antenna and Propagation, Vol. 53, No. 12, pp 4145-4156, Dec. 2005.
• W.C. Chew, B. Hu, Y.C. Pan, and L.J. Jiang, “Fast Algorithm for Layered Medium,” Comptes Rendus Physics, vol. 6, pp. 604-617, 2005.
• L.J. Jiang, W.C. Chew, and Y.C. Pan, “Capacitance Extraction in the Multilayer Medium Using DCIM and SMFMA,” Journal of Electromagnetic Waves and Applications. Vol. 19. No. 14, 1851-1864, 2005.
• W.C. Chew, L.J. Jiang, Y.H. Chu, G.L. Wang, I.T. Chiang, Y.C. Pan, and J.S. Zhao, “Toward a More Robust and Accurate CEM Fast Integral Equation Solver for IC Applications”, IEEE Transaction on Advanced Packaging, vol. 28, no. 3, pp 449-464, Aug. 2005.
• L.J. Jiang and W.C. Chew, “Low Frequency Inhomogeneous Plane Wave Algorithm – LF-FIPWA”, Microwave and Optical Technology Letter, vol. 40, issue 2, Jan. 2004.
• L.J. Jiang and W.C. Chew, “A New Capacitance Extraction Method”, Journal of Electromagnetic Waves and Applications, vol. 18, no. 3, pp.287-299, 2004.
• W.C. Chew and L.J. Jiang, “Two-Dimension Fast Evanescent-Wave Algorithm”, Microwave and Optical Technology Letter, vol. 31, no. 6, 2001.

• Y.M. WU, L.J. Jiang, and W.C. Chew, "An Efficient Method for Computing Highly Oscillatory Physical Optics Integral," PIERS, Kuala Lumpur, Malaysia, Mar. 27-30, 2012.
• N. Huang and L.J. Jiang, "Simulations of Pulse Signals with X-Parameters," IEEE EPEP, San Jose, CA, Oct. 23-26, 2011.
• G. Antonini, A. Ruehli, L.J. Jiang, "Mixed Integral-Differntial Skin-Effect Models for PEEC Electromagnetic Solver," IEEE EPEP, San Jose, CA, Oct. 23-26, 2011.
• P. Li and L.J. Jiang, “A Novel Characterization Method of the Radiation Emission for Electromagnetic Compatibility,” 2011 IEEE EMC Symposium, Long Beach, CA, Aug. 2011. (Invited Talk)
• Qi Dai, Weng Cho Chew, Yang G. Liu, Bo Zhu, and Lijun Jiang, “Generalized Modal Expansion of Electromagnetic Fields in Unbounded Media,” 2011 PIERS, Suzhou, China, Sept. 12-16, 2011.
• Y.P. Chen, W. C. Chew, and L. J. Jiang, “A Matrix Representation of Dyadic Green’s Function for Modeling General Dielectric Objects Embedded in a Layered Medium,” 2011 PIERS, Suzhou, China, Sept. 12-16, 2011.
• Y. P. Chen, L.J. Jiang, Z.G. Qian, and W. C. Chew, "Modeling Electrically Small Structures in Layered Medium with Augmented EFIE Method," 2011 IEEE AP-S Symposium, Spokane, Washington, USA, Jul. 2011.
• Y. P. Chen, W. C. Chew, and L.J. Jiang, "A New Closed-Form Evaluation of Layered Medium Green’s Function," 2011 IEEE AP-S Symposium, Spokane, Washington, USA, Jul. 2011.
• A.T. deHoop and L. J. Jiang, “Reflection and Transmission of Line-Source Excited Pulsed EM Fields at A Thin, High-Contrast Layer With Dielectric and Conductive Properties,” 2011 IEEE AP-S Symposium, Spokane, Washington, USA, Jul. 2011.
• Yat Hei Lo, Shiquan He, Lijun Jiang, and Weng Cho Chew, “Finite-Width Gap Excitation and Impedance Models,” 2011 IEEE AP-S Symposium, Spokane, Washington, USA, Jul. 2011.
• Shiquan He, Zaiping Nie, Jun Huang, Lijun Jiang, and Weng Cho Chew, “Finite Element Based Generalized Impedance Boundary Condition for Complicated EM Calculation,” 2011 IEEE AP-S Symposium, Spokane, Washington, USA, Jul. 2011.
• L.J. Jiang and W.C. Chew, “Review Of Low Frequency Computational Electromagnetics,” 2011 ICMTCE, Beijing, China, May 2011. (Keynote Speech)
• L.J. Jiang, “Computational Electromagnetics for Integrated Circuits,” 2011 International Workshop on Electromagnetic Theory, Modeling, and Simulation, Chengdu, China, Jun. 2011. (Keynote Speech)
• S.Q. He, P. H. Yang, L.J. Jiang, W.C. Chew, and Z.P. Nie, “Generalized Impedance Boundary Conditions Based on the Finite Element Method and Its Applications to Aid RFID Antenna Design,” 2011 27th ACES, Williamsburg, VA, Mar. 2011. (Invited)
• Y.Z. Xu, Q. Chen, L.J. Jiang, and N. Wong, “Process-variation-aware Electromagnetic-semiconductor Coupled Simulation,” 2011 IEEE International Symposium on Circuits and Systems (ISCAS), pp 2853 – 2856, Brazil, May 2011.
• Z.H. Ma, L.J. Jiang, W.C. Chew, M.K. Li and Z.G. Qian, “Augmented EPA with Augmented EFIE Method for Packaging Analysis,” 2010 IEEE EDAPS, pp 1~4, Singapore, Dec. 2010.
• Y.G. Liu, W.C. Weng, L.J. Jiang, “A Memory Saving Vector Fast Multipole Algorithm For Solving The Augmented EFIE,” 2010 EMTS, pp 134 – 137, Berlin, Aug. 2010. 
• A.T. deHoop and L.J. Jiang, “Time-Domain Field Responses of the Thin, High-Contrast, Finely Layered Structure In IC Packaging,” 2010 IEEE 19th Conference on EPEP, Austin, TX, Oct. 2010.
• Z.H. Ma, L.J. Jiang, Z.G. Qian, M.K. Li and W.C. Chew, “Solving Low Frequency Electromagnetic Problems With EPA And A-EFIE,” 2010 AP-RASC, Toyama, Japan, Sept. 2010.
• L.J. Jiang and A. Ruehli, “On The Frequency Barrier of Surface Integral Equations from a Circuit Point of View,” 2010 Progress In Electromagnetics Research Symposium, Boston, MA, Jul. 2010.
• L. J. Jiang, C. Xu, H. Smith, B. J. Rubin, A. Deutsch and A. Caron, “Electrical Modeling of Temperature Distributions in On-chip Interconnects, Packaging, and 3D Integration,” 2010 AP-EMC, Beijing, China, Apr. 2010.
• Z.G. Qian, M.K. Li, Z.H. Ma, L.J. Jiang and W.C. Chew, “Solving Multiscale Low Frequency Electromagnetic Problems”, the 4th European Conference on Antennas and Propagation, Barcelona, Spain, Apr. 2010.
• C. Xu, L.J. Jiang, S.K. Kolluri, B. Rubin, A. Deutsch, H. Smith, and K. Banerjee, “Fast 3-D Thermal Analysis of Complex Interconnect Structures Using Electrical Modeling and Simulation Methodologies,” IEEE/ACM ICCAD, pp 658 ~ 665, San Jose, CA, Nov. 2009.
• J. Walkil, E. Colgan, L.J. Jiang, S. Chen, and K. Sikka, “BEOL Thermal Characterization for 3-D Packaging,” 41st International symposium on Microelectronics, Providence, RI, Nov. 2008.
• J.Y. Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, L.J. Jiang, B.J. Rubin, “Electrical-thermal Co-analysis for Power Delivery Networks in 3D System Integration,” IEEE International Conference on 3D System Integration, pp 1 ~ 4, San Francisco, CA, Sept. 2009.
• L.J. Jiang, S. Kolluri, B. Rubin, H. Smith, E. Colgan, etc., “Thermal Modeling of On-chip Interconnects and 3D Packaging Using EM Tools,” 2008 IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, Oct. 2008.
• L.J. Jiang, S. Kolluri, B. Rubin, H. Smith, A. Deutsch, etc, “On-chip Electro-Thermal Analysis Using Electromagnetic Modeling Tools,” 2008 Progress in Electromagnetics Research Symposium, Cambridge, MA, Jul. 2008.
• H.Ch. Chen, L.J. Jiang, A. Deutsch, M. Angyal, and T. Spooner, “Interconnect Performance and Scaling Strategy for the 22nm Node and Beyond,” 2008 International Interconnect Technology Conference (IITC), Burlingame, CA, Jun 2008.
• L.J. Jiang, B. Rubin, Y. Liu, J.D Morsey, and A. Deutsch, “Electromagnetic Simulation for Inhomogeneous Interconnect and Packaging Structures,” IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging , Atlanta, GA, Oct. 2007.
• L.J. Jiang, J.D. Morsey, B. Rubin, and A. Deutsch, “Parallel Computational Electromagnetic Method, PCEM, for IC Interconnect and Packaging Analysis,” Progress in Electromagnetics Research Symposium, Beijing, China, Mar. 2007. (Invited Talk)
• L.J. Jiang, B. Rubin, and J.D Morsey, “Novel Capacitance Extraction Method Using Direct Boundary Integral Equation Method and Hierarchical Approach,” IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Scarsdale, AZ, 2006.
• M.K. Li, W.C. Chew and L.J. Jiang, “A Domain Decomposition Scheme to Solve Integral Equations Using Equivalent Surfaces,” IEEE Antennas and Propagation Society International Symposium and URSI, CA 2006.
• L.J. Jiang and W.C. Chew, “The Mixed-Form Fast Multipole Algorithm for Broadband Electromagnetic Simulations,” IEEE Antennas and Propagation Society International Symposium and URSI, Washington, DC, 2005.
• W.C. Chew and L.J. Jiang, “The General Variational Formulas for Capacitance Parameter Extraction,” IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, 2005.
• J. Morsey, A. Deutsch, J.P. Libous, C. Surovic, B. J. Rubin, L.J. Jiang, and L. Eisenberg, “The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM,” IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, 2005.
• Z.G. Qian, J. Xiong, L. Sun, I.T. Chiang, W.C. Chew, L.J. Jiang, and Y.H. Chu, “Crosstalk Analysis by Fast Compuational Algorithms,” IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, 2005.
• W.C. Chew, L.J. Jiang, Y.H. Chu, Y.A. Liu, M.K. Li, Z.G. Qian, J. Xiong and L. Sun, “Solving Low Frequency Electromagnetic Problems with Fast Solvers,” IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, 2005.
• W.C. Chew, L.J. Jiang, and Y.H. Chu, “Computational Electromagnetics at Very Low Frequencies,” PIERS, Nanjing, China, 2004.
• W.C. Chew, Y.H. Chu, L.J. Jiang, I.T. Chiang, Y.C. Pan, and J.S. Zhao, “Mixing Electromagnetic and Electrical Circuit Simulations,” IEEE Antennas and Propagation Society International Symposium and URSI, Monterey, CA, 2004.
• W. C. Chew, L. J. Jiang, Y. H. Chu, M. L. Hastriter, S. Velamparambil, “Recent Advances in Computational Electromagnetics: from the Very Low Frequency to Ultra Large Scale Problems,” Proceedings of the 2004 URSI EMT-S, vol. II, p.736-738, Pisa, Italy, May 23-27, 2004.
• L.J. Jiang and W.C. Chew, “Fast Multipole Algorithm Frame Analysis”, IEEE Antennas and Propagation Society International Symposium and URSI, Columbus, OH, 2003.
• L.J. Jiang and W.C. Chew, “Broad-band Computational Electromagnetics Algorithm-MFIPWA”, the 19th Review of Progress in Applied Computational Electromagnetics, Monterey, CA, 2003.
• L.J. Jiang and W.C. Chew, “Modified Fast Inhomogeneous Plane Wave Algorithm from Low Frequency to Microwave Frequency”, IEEE AP Society International Symposium, Columbus, OH, 2003.
• W.C. Chew and L.J. Jiang, “A Hybrid Fast Capacitance Solver”, IEEE Antennas and Propagation Society International Symposium and URSI, Columbus, OH, 2003.
• W.C. Chew, L.J. Jiang, Y.H. Chu, and G.L. Wang, and Y. Pan, “Toward a More Robust and Accurate Fast Integral Equation Solver for Microstrip Applications”, 12th Topical Meeting on Electrical Performance of Electronic Packaging, Princeton, NJ, 2003.
• L.J. Jiang, W.C. Chew and Y.C. Pan, “DCIM-Accelerated SMFMA for Capacitance Extraction”, IEEE Antennas and Propagation Society International Symposium and URSI, Columbus, OH, 2003.
• L.J. Jiang and W.C. Chew, “A New Plane-Wave Representation of 3D Point Sources”, IEEE Antennas and Propagation Society International Symposium, San Antonio, TX, 2002.
• W.C. Chew and L.J. Jiang, “A Fast Evanescent-Wave Algorithm”, IEEE Antennas and Propagation Society International Symposium, Boston, MA, 2001.

• D. Qi, W.C. Chew, L.J. Jiang, and B. Zhu, Compact Electronic Mode Stirred Chamber, US Prov. Application No. 61/433,816 filed on Jan 18th, 2011.
• L.J. Jiang, J. D. Morsey, B. J. Rubin, W.C. Chew, M. K. Li, and Y. Liu, Huygens’ Box Methodology for Signal Integrity Analysis, US7707527 B2, Date of Patent: Apr. 27, 2010.
• L.J. Jiang and J.D. Morsey, Double-layer Integral Using Static Green’s Function and Rectangular Basis, US 7844418, Pub Date: Jun 4th, 2009, Issue Date: Nov. 30, 2010.
• L.J. Jiang, H. Smith, A. Deutsch, K. Chanda, B.J. Rubin, J. Gill, and S.K. Kolluri, Methodology for Thermal Modeling of On-chip Interconnects Based on Electromagnetic Simulation Tools, US 2009/0164183 A1, Pub. Date: Jun. 25, 2009.