{"id":307,"date":"2022-01-05T14:43:45","date_gmt":"2022-01-05T06:43:45","guid":{"rendered":"https:\/\/www.eee.hku.hk\/microLED\/?p=307"},"modified":"2022-01-11T11:38:00","modified_gmt":"2022-01-11T03:38:00","slug":"flexible-gan-light-emitting-diodes","status":"publish","type":"post","link":"https:\/\/www.eee.hku.hk\/microLED\/flexible-gan-light-emitting-diodes\/","title":{"rendered":"Flexible GaN light-emitting diodes"},"content":{"rendered":"\n<p class=\"has-text-align-right\">&#8211; <em>HW Choi, KH Li, and YF Cheung<\/em><\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1014\" height=\"722\" src=\"https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US10615222-20200407-D00000.png\" alt=\"\" class=\"wp-image-308\" srcset=\"https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US10615222-20200407-D00000.png 1014w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US10615222-20200407-D00000-300x214.png 300w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US10615222-20200407-D00000-768x547.png 768w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US10615222-20200407-D00000-421x300.png 421w\" sizes=\"auto, (max-width: 1014px) 100vw, 1014px\" \/><\/figure>\n\n\n\n<p>Publication Date: 2020<\/p>\n\n\n\n<p>Patent Office: US<\/p>\n\n\n\n<p>Patent Number: <a href=\"https:\/\/patents.google.com\/patent\/US10615222B2\/en\" data-type=\"URL\" data-id=\"https:\/\/patents.google.com\/patent\/US10615222B2\/en\">US 10,615,222<\/a><\/p>\n\n\n\n<p>Methods of fabricating flexible, free-standing LED structures are provided. An LED structure can be formed on a sapphire substrate, and the surface of the LED structure can then be coated with epoxy and attached to a rigid supporting substrate. A laser lift-off process can be performed using an ultraviolent beam from a high-power pulsed-mode laser and a shadow mask, causing at least a portion of the LED structure to separate from the sapphire substrate. The structure can then be immersed in an acetone bath to dissolve the epoxy and separate the structure from the supporting substrate.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>&#8211; HW Choi, KH Li, and YF Cheung Publication Date: 2020 Patent Office: US Patent Number: US 10,615,222 Methods of fabricating flexible, free-standing LED structures&hellip;<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[2],"tags":[12,8,14],"class_list":["post-307","post","type-post","status-publish","format-standard","hentry","category-patents","tag-led","tag-monolithic","tag-thin-film"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/307","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/comments?post=307"}],"version-history":[{"count":1,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/307\/revisions"}],"predecessor-version":[{"id":309,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/307\/revisions\/309"}],"wp:attachment":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/media?parent=307"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/categories?post=307"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/tags?post=307"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}