{"id":310,"date":"2022-01-05T14:45:46","date_gmt":"2022-01-05T06:45:46","guid":{"rendered":"https:\/\/www.eee.hku.hk\/microLED\/?p=310"},"modified":"2022-01-06T14:33:21","modified_gmt":"2022-01-06T06:33:21","slug":"chip-stacking","status":"publish","type":"post","link":"https:\/\/www.eee.hku.hk\/microLED\/chip-stacking\/","title":{"rendered":"Chip stacking"},"content":{"rendered":"\n<p class=\"has-text-align-right\">&#8211; <em>HW Choi<\/em><\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"989\" src=\"https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-1024x989.png\" alt=\"\" class=\"wp-image-311\" srcset=\"https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-1024x989.png 1024w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-300x290.png 300w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-768x742.png 768w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-1536x1484.png 1536w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-2048x1978.png 2048w, https:\/\/www.eee.hku.hk\/microLED\/wp-content\/uploads\/2022\/01\/US20120292788A1-20121122-D00001-311x300.png 311w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p>Publication Date: 2012<\/p>\n\n\n\n<p>Patent Office: US<\/p>\n\n\n\n<p>Patent Number: <a href=\"https:\/\/patents.google.com\/patent\/US20120292788A1\/en\" data-type=\"URL\" data-id=\"https:\/\/patents.google.com\/patent\/US20120292788A1\/en\">US Patent Application 2012\/0292788<\/a><\/p>\n\n\n\n<p>Methods and systems are provided to utilize and manufacture a stacked chip assembly. Microelectronic or optoelectronic chips of any dimensions are directly stacked onto each other. The chips can be of substantially identical sizes. To enable forming the stacked chip assembly, trenches are laser micro-machined onto the bottom surface of a chip to accommodate the bond wedge\/ball and wire path of the chip beneath it. Consequently, chips can be tightly integrated without a gap and without having to reserve space for the bond wedges\/balls.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>&#8211; HW Choi Publication Date: 2012 Patent Office: US Patent Number: US Patent Application 2012\/0292788 Methods and systems are provided to utilize and manufacture a&hellip;<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[2],"tags":[7,4,18],"class_list":["post-310","post","type-post","status-publish","format-standard","hentry","category-patents","tag-color-tuning","tag-microled","tag-stacking"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/310","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/comments?post=310"}],"version-history":[{"count":1,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/310\/revisions"}],"predecessor-version":[{"id":312,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/posts\/310\/revisions\/312"}],"wp:attachment":[{"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/media?parent=310"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/categories?post=310"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.eee.hku.hk\/microLED\/wp-json\/wp\/v2\/tags?post=310"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}