Dr. Q. Chen
B.Sc., M.Phil., Ph.D.
Office: CB 521
Dr. Quan Chen
Research Assistant Professor
Multi-physics and Multi-scale Modeling and Simulation; Electronic design automation; Numerical methods for large-scale scientific computing; Applied Electromagnetics; Parallel computing.
Dr. Quan Chen received the B.Sc. degree in Electronic Engineering from the Sun Yat-Sen University, China. He obtained the M. Phil. and Ph. D. degree in electronic engineering from The University of Hong Kong, Hong Kong, in 2007 and 2010, respectively.
From 2010 to 2011, he was a postdoctoral fellow in the department of Computer Science and Engineering of the University of California, San Diego. He worked as a postdoctral fellow in the department of Electrical and Electronic Engineering of The University of Hong Kong from 2011 to 2012, where he is now a Research Assistant Professor.
Dr. Chen’s main research interest is in the multi-physics and multi-scale modeling of microelectronic systems. He has been working closely with research groups in the Faculty of Science, HKU in the UGC Area of Excellence, Theory, Modeling, and Simulation of Emerging Electronics, since 2009, primarily on the combination of semi-classical semiconductor device model with quantum mechanical model. Dr. Chen is a member of IEEE. He served regularly as the reviewers of several journals, such as IEEE transactions on Computer-Aided Design for Integrated Circuits, Advanced Packaging and Magnetics.
- Q. Chen, W. Schoenmaker, G. H. Chen, L. J. Jiang and N.Wong, “Numerically efficient formulation for time-domain electromagnetic-semiconductor co-simulation for Fast-Transient Systems,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, In press.
- Q. Chen, S. L. Ho, and W. N. Fu, “Numerical investigation of magnetic resonant coupling technique in inter-chip communication via electromagnetics-TCAD coupled simulation,” IEEE Trans. on Magnetics, vol. 48, no. 11, pp. 4253-4256, Oct. 2012.
- Q. Chen, W. Schoenmaker, S. H.Weng, C. K. Cheng, G. H. Chen, L. J. Jiang and N. Wong, “A fast time-domain EM-TCAD coupled simulation framework via matrix exponential,” in Proc. of IEEE Intl. Conf. on Computer-Aided Design (ICCAD), pp. 422-428, San Jose, Nov. 2012 (Best Paper Award Candidate).
- S. H. Weng, Q. Chen, N. Wong and C. K. Cheng, “Circuit simulation using matrix exponential method for stiffness handling and parallel processing,” in Proc. of IEEE Intl. Conf. on Computer-Aided Design (ICCAD), pp. 407-414, San Jose, Nov. 2012.
- S. H. Weng, Q. Chen, and C. K. Cheng, “Time-domain analysis of large-scale circuits by matrix exponential method with adaptive control,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol.31, no. 8, pp. 1180-1193, Aug. 2012.
- Q. Chen, S. H. Weng, and C. K. Cheng, “A practical regularization technique for modified nodal analysis in large-scale time-domain circuit simulation,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 31, no. 7, pp. 1031-1040, Jul. 2012.
- L. Meng, C. Yam, S. Koo, Q. Chen, N. Wong, and G. H. Chen, “Dynamic multiscale quantum mechanics-electromagnetics simulation method,” Journal of Chemical Theory and Computation, vol. 8, no. 4, pp. 1190-1199, Feb. 2012.
- C. Y. Yam, L. Y. Meng, G. H. Chen, Q. Chen and N. Wong, “Multiscale quantum mechanics / electromagnetics simulation for electronic devices,” Journal of Physical Chemistry Chemical Physics (PCCP), vol. 13, no. 32, pp. 14365-14369, Jun. 2011. (Invited Paper)
- Q. Chen, W. Schoenmaker, P. Meuris and N. Wong, “An effective formulation of coupled electromagnetic-TCAD simulation for extremely high frequency onwards,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 6, pp. 866-876, Jun. 2011.
- C. U. Lei, Y. Wang, Q. Chen and N. Wong, “A decade of vector fitting development: applications on signal/power integrity,” IAENG Trans. on Engineering Technologies, vol. 1285, pp. 435-449, The American Institute of Physics, Oct. 2010.
- Q. Chen, H. W. Choi and N. Wong, “Robust simulation methodology for surface roughness loss in interconnect and package modeling,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol.28, no. 11, pp. 1654-1665, Nov. 2009.
- Q. Chen and N. Wong, “Efficient numerical modeling of random rough surface effects in interconnect resistance extraction,” Intl. Journal of Circuit Theory and Applications, vol. 37, no. 6, pp. 751-763, Aug. 2009.